InPlan™ 2.30 introduces a new Impedance Coupon Generator module, which generates coupons that meet all DRC, signal integrity and testability requirements while minimizing the coupon footprint on the panel. Also new in this version is the ability to create and work with dummy copper layers throughout the engineering process. These layers are graphically differentiated in the buildup.

In addition, InPlan™ 2.30 introduces a new interlocking mechanism in panel design to deliver more sophisticated layouts for non-rectangular part shapes and to achieve optimum material utilization.

Major functionality and usability enhancements have also been added to the Traveler Editor, Stackup subsystem and impedance modeling capabilities.

See: Support Latest Version section for a full list of new features and enhancements.